A Guide to Lead-free Solders: Physical Metallurgy and by John W. Evans PhD (auth.), Werner Engelmaier Dipl.-Ing.

By John W. Evans PhD (auth.), Werner Engelmaier Dipl.-Ing. (eds.)

While tin/lead solders have ruled the electronics for a few years, environmental concerns and new laws are forcing switch. subsidized through greater than ten years of study in Pb-free solders, many electronics brands are poised for conversion.

A advisor to Lead-free Solders is meant as a device to aid because it strikes right into a new period within the creation and use of solders. an summary of the foundations of soldering know-how is supplied starting with the idea underlying each one inspiration. targeting the main updated equipment for checking out and characterization, those theories are then bolstered through experimental examples and business applications.

• Addresses key concerns in meeting from a fabrics aspect of view.

• supplies the reader handy entry to information crucial for the right kind review and employment of state-of-the-art ternary Sn/Ag/X solders

• permits comparability of the functionality of Pb-free solders with that of normal eutectic SnPb.

Although basically of curiosity to specialist layout and reliability engineers operating in electronics meeting and production, A consultant to Lead-free Solders may also be important for graduate scholars trying to follow services in fabrics, mechanical or digital engineering during this undefined. Researchers in electronics and fabrics will locate the newest examine at their fingertips including the most likely instructions will want from such learn within the future.

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Extra info for A Guide to Lead-free Solders: Physical Metallurgy and Reliability

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Preheating ramp rates and ramp-up to melting are between 13°C per min to throughput without damage and with low defect rates. 11 shows a typical reflow profile that is recommended for SnAgCu paste. 5 Wave Soldering Wave soldering is used to create joints for through-hole configurations as well as to solder chip components. 12, has been in wide use for many years with near-eutectic SnPb due to its cost advantages and high throughput for high-volume products. Preheating, wave temperature and wave exposure time are among the most important parameters.

And Morris, J. , (December 1989), “Creep in Shear of Experimental Solder Joints”, The American Society of Mechanical Engineers Winter Annual Meeting, 89-WA/EEP30, San Francisco, CA. Trumble, B. (1998), “Get The Lead Out”, IEEE Spectrum, May, 1998, pp 55–60. Tsukada, Y. (1999) New Era of Electronics Packaging and Its Technical Difficultiles, EEP Vol. 26-1, Advanced in Van Der Molen, T. (November 1990), private communication. Van der Molen, (1990), “Unpublished Work”. , (1990), “Effects of Temperature on Isothermal Fatigue of Solders”, IEEE Transactions on Components Hybrids and Manufacturing Technology, Vol.

Hull, S. , (1993), “The Effects of Cerium and Silver Alloying on Microstructure and Fatigue in Near-Eutectic Solders”, International Journal of Microcircuits and Electronic Packaging, Vol. 16, No. 4, pp. 363372. Frear, D. , Jones W. , and Kinsman, K. , (1991), Solder Mechanics: A State of the Art Assessment, The Minerals, Metals and Materials Society, EMPMD Monograph, pp 155189. Fuchs, H. O. and Stephens, R. , (1980), Metal Fatigue in Engineering, John Wiley and Sons, New York, pp. 7881, pp 182184.

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